Box Build & Systems Integration
Full mechanical and electrical integration — enclosures, cable/harness assembly, and final unit configuration.
- Enclosure fit & mechanical integration
- Cable / harness assembly
- Firmware flash, configuration & labeling
Service
Engineering & DFM Support
Design-for-manufacturability review, file checking, and BOM/component sourcing before your first panel runs.
- Gerber / ODB++ / IPC-2581 file checking
- Stack-up and panelization DFM review
- BOM engineering & component sourcing support
Every RFQ is reviewed by an applications engineer against your submitted Gerbers, ODB++ or IPC-2581 files, and BOM before it’s scheduled — checking trace/space against the fab capability you selected, drill-to-copper clearances, panelization fit, and component footprint conflicts. Catching a DFM issue before the first panel runs is materially cheaper than catching it after assembly, and it’s the step most responsible for the yield differences customers report after switching vendors.
Component sourcing and BOM engineering support is available for programs navigating allocation or end-of-life parts, with substitution recommendations reviewed against your design intent rather than a blind cross-reference swap.
Ready to spec this out?
Configure your build on the RFQ calculator or send us your board files directly.
More Services
The rest of the production floor.
Testing & Inspection
AOI on every panel, with X-ray, ICT, and functional test added per your acceptance criteria.
- AOI on 100% of panels, every lot
- X-ray inspection for BGA / QFN joints
- ICT and custom functional test fixtures
PCB Fabrication
Bare-board fabrication from 2 to 12 copper layers on FR4, high-Tg, and RF laminates, built to the stack-up you configure.
- 2–12 copper layers, FR4 / high-Tg / RF laminates
- 3/3 mil standard, 2/2 mil advanced trace/space
- HASL, ENIG, and OSP surface finishes