Bare-board fabrication from 2 to 12 copper layers on FR4, high-Tg, and RF laminates, built to the stack-up you configure.
Copperline’s fabrication line runs 2 through 12 copper layers on FR4, high-Tg FR4, and RF-grade laminates, with in-house imaging, lamination, mechanical and laser drilling, copper plating, and your choice of surface finish. Every job starts from the exact stack-up you configure in the RFQ calculator — real per-layer copper weights and dielectric thicknesses, not a generic “multilayer” line item.
Standard capability holds 3/3 mil trace and space with 8 mil mechanical vias; the advanced line steps down to 2/2 mil trace and space with 4 mil laser microvias for dense BGA fan-out. Panels ship against a standard 457 × 610 mm production panel, with utilization computed for your specific board outline so quoted pricing reflects real panelization, not a flat per-square-inch rate.
Configure your build on the RFQ calculator or send us your board files directly.
Automated SMT placement and through-hole assembly covering 01005 passives up to large BGA and QFN packages.
Full mechanical and electrical integration — enclosures, cable/harness assembly, and final unit configuration.
Design-for-manufacturability review, file checking, and BOM/component sourcing before your first panel runs.