Box Build & Systems Integration
Full mechanical and electrical integration — enclosures, cable/harness assembly, and final unit configuration.
- Enclosure fit & mechanical integration
- Cable / harness assembly
- Firmware flash, configuration & labeling
Service
SMT & Through-Hole Assembly
Automated SMT placement and through-hole assembly covering 01005 passives up to large BGA and QFN packages.
- 01005 to large BGA / QFN / CSP, 0.3mm pitch
- Lead-free and leaded process lines qualified
- Engineered stencil & paste-print per board
Our assembly floor runs automated SMT placement lines alongside selective and wave soldering for through-hole components, so mixed-technology boards run through a single production flow instead of being split across vendors. Placement accuracy holds tight enough for 01005 passives at one end of the range and large BGA, QFN, and CSP packages at 0.3 mm pitch at the other.
Both lead-free and leaded process lines are qualified, and stencil design and paste-print parameters are engineered per board rather than reused from a generic template — a meaningful source of first-pass yield problems we see when programs move from another vendor.
Ready to spec this out?
Configure your build on the RFQ calculator or send us your board files directly.
More Services
The rest of the production floor.
Testing & Inspection
AOI on every panel, with X-ray, ICT, and functional test added per your acceptance criteria.
- AOI on 100% of panels, every lot
- X-ray inspection for BGA / QFN joints
- ICT and custom functional test fixtures
PCB Fabrication
Bare-board fabrication from 2 to 12 copper layers on FR4, high-Tg, and RF laminates, built to the stack-up you configure.
- 2–12 copper layers, FR4 / high-Tg / RF laminates
- 3/3 mil standard, 2/2 mil advanced trace/space
- HASL, ENIG, and OSP surface finishes