AOI on every panel, with X-ray, ICT, and functional test added per your acceptance criteria.
Every panel that leaves the assembly line passes automated optical inspection (AOI) as a standard step, not an add-on. Programs with BGA, QFN, or other hidden-joint packages add X-ray inspection to verify solder-joint integrity underneath the package where AOI can’t see. In-circuit test (ICT) and custom functional test fixtures are built per program for customers who need electrical verification beyond visual and X-ray inspection.
Inspection results, AOI images, and test logs are retained against lot and serial number, so a field issue can be traced back to the specific panel, operator, and test run that produced the affected unit — the documentation regulated programs like medical device and automotive typically require as a condition of qualification.
Configure your build on the RFQ calculator or send us your board files directly.
Bare-board fabrication from 2 to 12 copper layers on FR4, high-Tg, and RF laminates, built to the stack-up you configure.
Automated SMT placement and through-hole assembly covering 01005 passives up to large BGA and QFN packages.
Full mechanical and electrical integration — enclosures, cable/harness assembly, and final unit configuration.