Bare-board fabrication from 2 to 12 copper layers on FR4, high-Tg, and RF laminates, built to the stack-up you configure.
- 2–12 copper layers, FR4 / high-Tg / RF laminates
- 3/3 mil standard, 2/2 mil advanced trace/space
- HASL, ENIG, and OSP surface finishes
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Automated SMT placement and through-hole assembly covering 01005 passives up to large BGA and QFN packages.
- 01005 to large BGA / QFN / CSP, 0.3mm pitch
- Lead-free and leaded process lines qualified
- Engineered stencil & paste-print per board
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Full mechanical and electrical integration — enclosures, cable/harness assembly, and final unit configuration.
- Enclosure fit & mechanical integration
- Cable / harness assembly
- Firmware flash, configuration & labeling
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AOI on every panel, with X-ray, ICT, and functional test added per your acceptance criteria.
- AOI on 100% of panels, every lot
- X-ray inspection for BGA / QFN joints
- ICT and custom functional test fixtures
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Design-for-manufacturability review, file checking, and BOM/component sourcing before your first panel runs.
- Gerber / ODB++ / IPC-2581 file checking
- Stack-up and panelization DFM review
- BOM engineering & component sourcing support
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