Services

One production floor, start to finish.

Fabrication, assembly, integration, and testing under one roof — no hand-offs between vendors on the same program.

PCB Fabrication

Bare-board fabrication from 2 to 12 copper layers on FR4, high-Tg, and RF laminates, built to the stack-up you configure.

  • 2–12 copper layers, FR4 / high-Tg / RF laminates
  • 3/3 mil standard, 2/2 mil advanced trace/space
  • HASL, ENIG, and OSP surface finishes
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SMT & Through-Hole Assembly

Automated SMT placement and through-hole assembly covering 01005 passives up to large BGA and QFN packages.

  • 01005 to large BGA / QFN / CSP, 0.3mm pitch
  • Lead-free and leaded process lines qualified
  • Engineered stencil & paste-print per board
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Box Build & Systems Integration

Full mechanical and electrical integration — enclosures, cable/harness assembly, and final unit configuration.

  • Enclosure fit & mechanical integration
  • Cable / harness assembly
  • Firmware flash, configuration & labeling
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Testing & Inspection

AOI on every panel, with X-ray, ICT, and functional test added per your acceptance criteria.

  • AOI on 100% of panels, every lot
  • X-ray inspection for BGA / QFN joints
  • ICT and custom functional test fixtures
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Engineering & DFM Support

Design-for-manufacturability review, file checking, and BOM/component sourcing before your first panel runs.

  • Gerber / ODB++ / IPC-2581 file checking
  • Stack-up and panelization DFM review
  • BOM engineering & component sourcing support
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Ready to configure your build?

Use the RFQ calculator to get a real, computed estimate before you talk to a sales engineer.

Configure Your Build