PCB Fabrication · SMT/THT Assembly · Box Build

Contract electronics manufacturing, quoted in real time.

Copperline fabricates PCBs and assembles finished electronics for medical device, automotive, industrial IoT, consumer electronics, and aerospace instrumentation companies. Configure your stack-up below and get a real, computed estimate — not a form that just says "someone will call you."

Configure Your Build

Real stack-up. Real panel math. Real estimate.

Pick a layer count and board size. We generate the actual copper/dielectric stack-up, compute real panel utilization against a standard fab panel, and estimate unit and total project cost.

Total Thickness
Copper Layers
Boards / Panel
Panel Utilization
Est. Unit Price
Est. Total Project Cost
These board dimensions exceed the standard fab panel in every orientation. Reduce the board size or contact us for a custom panel quote.

Estimated for planning purposes only — not a binding quote. Final pricing is confirmed by an applications engineer after DFM review.

Capabilities

Fabrication specs, straight from the line.

What the fab and assembly lines actually support — not a rounded-up marketing capability chart.

Layer Counts Supported
2, 4, 6, 8, 10, 12
Min. Trace / Space — Standard
3 / 3 mil
Min. Trace / Space — Advanced
2 / 2 mil
Min. Via Size
8 mil mechanical · 4 mil laser microvia
Component Packages
0201 to BGA / QFN / CSP, 0.3 mm pitch
Surface Finishes
HASL, Lead-Free HASL, ENIG, OSP
Standard Panel Size
457 × 610 mm
Max Board Dimensions
450 × 600 mm single-piece
Board Thickness Range
0.2 mm – 3.2 mm
Copper Weight
0.5 oz – 3 oz
Services

One production floor, start to finish.

Fabrication, assembly, integration, and testing under one roof — no hand-offs between vendors on the same program.

PCB Fabrication

Bare-board fabrication from 2 to 12 copper layers on FR4, high-Tg, and RF laminates, built to the stack-up you configure.

  • 2–12 copper layers, FR4 / high-Tg / RF laminates
  • 3/3 mil standard, 2/2 mil advanced trace/space
  • HASL, ENIG, and OSP surface finishes
Learn more

SMT & Through-Hole Assembly

Automated SMT placement and through-hole assembly covering 01005 passives up to large BGA and QFN packages.

  • 01005 to large BGA / QFN / CSP, 0.3mm pitch
  • Lead-free and leaded process lines qualified
  • Engineered stencil & paste-print per board
Learn more

Box Build & Systems Integration

Full mechanical and electrical integration — enclosures, cable/harness assembly, and final unit configuration.

  • Enclosure fit & mechanical integration
  • Cable / harness assembly
  • Firmware flash, configuration & labeling
Learn more

Testing & Inspection

AOI on every panel, with X-ray, ICT, and functional test added per your acceptance criteria.

  • AOI on 100% of panels, every lot
  • X-ray inspection for BGA / QFN joints
  • ICT and custom functional test fixtures
Learn more

Engineering & DFM Support

Design-for-manufacturability review, file checking, and BOM/component sourcing before your first panel runs.

  • Gerber / ODB++ / IPC-2581 file checking
  • Stack-up and panelization DFM review
  • BOM engineering & component sourcing support
Learn more
Manufacturing Process

From DFM review to your dock.

DFM Review

Every job starts with a design-for-manufacturability check against your Gerbers, BOM, and stack-up before a single panel is scheduled.

PCB Fabrication

Copper imaging, lamination, drilling, plating, and surface finish — built to the stack-up you configure above.

SMT / THT Assembly

Automated placement and reflow for SMT, selective or wave soldering for through-hole, on the same production floor.

AOI & Testing

Automated optical inspection on every panel, with X-ray, ICT, or functional test added per your acceptance criteria.

Ship

Packed to your labeling and traceability requirements, shipped against the turnaround tier you selected.

Case Studies

Programs across five industries.

Anonymized at customer request — the specifics are real, the names are not.

Quality & Certifications

Built to the standard your program requires.

ISO 9001:2015

Certified quality management system covering design transfer, production control, and continuous improvement across the facility.

IPC-A-610 Class 2 / 3

Assemblies built and inspected to IPC-A-610 acceptability criteria, with Class 3 available for high-reliability programs.

IATF 16949

Automotive-program production lines operate under IATF 16949 process controls for traceability and defect-rate discipline.

UL Certified

UL-recognized processes and materials for programs requiring listed or recognized component certification.

All pricing shown by the Configure Your Build calculator is a rough order-of-magnitude estimate for planning purposes only and is not a binding quotation. Final pricing is confirmed by a Copperline applications engineer after DFM review of submitted board files.

What Customers Say

Engineering teams stay engineering teams.

“We moved our sensor board line to Copperline mid-program after a yield problem at our previous fab. The DFM review caught two trace-width issues before the first panel ever ran — issues our old vendor never flagged.”

VP of Hardware Engineering Industrial automation company

“The RFQ calculator got us within a few percent of the final quote before we'd even sent Gerbers. For a program running a dozen SKUs a year, that kind of budgeting accuracy up front matters more than people expect.”

Director of Manufacturing Consumer electronics OEM

“IPC-A-610 Class 3 acceptance and full AOI/X-ray documentation on every lot — for a Class II device program, that paper trail is as important as the boards themselves.”

Principal Electrical Engineer Medical device manufacturer

“IATF 16949 was a hard requirement for us. Copperline was upfront about exactly which lines run under that certification instead of a vague 'we can do automotive' answer.”

Supply Chain Manager Automotive Tier 1 supplier
Get Started

Request a quote.

Tell us about your board and an applications engineer will follow up with pricing and lead time.

No obligation. An applications engineer typically responds within one business day after DFM review.