Automotive Tier-1 Automotive Supplier — Body Control Module Volume Ramp
A Tier-1 automotive supplier moved a body control module from a low-volume prototype vendor to production-scale supply under IATF 16949.
- Layers
- 6
- Volume
- 240,000 units/year
A Class II diagnostic device maker requalified a failing sensor board line without slipping a regulatory-locked launch date.
A Class II diagnostic device manufacturer was six weeks from a regulatory-locked launch date when their existing sensor board vendor's yield dropped below 80% on an 8-layer board with tight impedance-controlled traces. Every day spent requalifying threatened the launch window, and any design change risked reopening part of the regulatory submission.
Copperline's applications team reviewed the existing Gerbers and impedance stack-up without requesting a redesign, identifying a lamination-sequence mismatch between the specified core/prepreg pairing and the vendor's actual production stack as the likely yield driver. A corrected stack-up was proposed that held the same electrical characteristics and required no changes to the submitted design files, then validated with a small pilot panel before committing to full volume.
Pilot yield came back above 96%, and full production ramped in time to hold the original launch date. The board now runs at 18,000 units/year with IPC-A-610 Class 3 acceptance criteria and full AOI/X-ray documentation retained per lot, per the manufacturer's quality system requirements.
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Automotive A Tier-1 automotive supplier moved a body control module from a low-volume prototype vendor to production-scale supply under IATF 16949.
Industrial IoT A field gateway maker traced recurring thermal-cycling failures to a stack-up problem and worked with Copperline to redesign for reliability.
Consumer Electronics A consumer electronics brand needed a single manufacturing partner to carry a product from low-volume launch through mainstream retail volume.