Design-for-manufacturability review, file checking, and BOM/component sourcing before your first panel runs.
Every RFQ is reviewed by an applications engineer against your submitted Gerbers, ODB++ or IPC-2581 files, and BOM before it’s scheduled — checking trace/space against the fab capability you selected, drill-to-copper clearances, panelization fit, and component footprint conflicts. Catching a DFM issue before the first panel runs is materially cheaper than catching it after assembly, and it’s the step most responsible for the yield differences customers report after switching vendors.
Component sourcing and BOM engineering support is available for programs navigating allocation or end-of-life parts, with substitution recommendations reviewed against your design intent rather than a blind cross-reference swap.
Configure your build on the RFQ calculator or send us your board files directly.
Automated SMT placement and through-hole assembly covering 01005 passives up to large BGA and QFN packages.
AOI on every panel, with X-ray, ICT, and functional test added per your acceptance criteria.
Bare-board fabrication from 2 to 12 copper layers on FR4, high-Tg, and RF laminates, built to the stack-up you configure.