Box Build & Systems Integration
Full mechanical and electrical integration — enclosures, cable/harness assembly, and final unit configuration.
- Enclosure fit & mechanical integration
- Cable / harness assembly
- Firmware flash, configuration & labeling
Service
PCB Fabrication
Bare-board fabrication from 2 to 12 copper layers on FR4, high-Tg, and RF laminates, built to the stack-up you configure.
- 2–12 copper layers, FR4 / high-Tg / RF laminates
- 3/3 mil standard, 2/2 mil advanced trace/space
- HASL, ENIG, and OSP surface finishes
Copperline’s fabrication line runs 2 through 12 copper layers on FR4, high-Tg FR4, and RF-grade laminates, with in-house imaging, lamination, mechanical and laser drilling, copper plating, and your choice of surface finish. Every job starts from the exact stack-up you configure in the RFQ calculator — real per-layer copper weights and dielectric thicknesses, not a generic “multilayer” line item.
Standard capability holds 3/3 mil trace and space with 8 mil mechanical vias; the advanced line steps down to 2/2 mil trace and space with 4 mil laser microvias for dense BGA fan-out. Panels ship against a standard 457 × 610 mm production panel, with utilization computed for your specific board outline so quoted pricing reflects real panelization, not a flat per-square-inch rate.
Ready to spec this out?
Configure your build on the RFQ calculator or send us your board files directly.
More Services
The rest of the production floor.
Testing & Inspection
AOI on every panel, with X-ray, ICT, and functional test added per your acceptance criteria.
- AOI on 100% of panels, every lot
- X-ray inspection for BGA / QFN joints
- ICT and custom functional test fixtures
SMT & Through-Hole Assembly
Automated SMT placement and through-hole assembly covering 01005 passives up to large BGA and QFN packages.
- 01005 to large BGA / QFN / CSP, 0.3mm pitch
- Lead-free and leaded process lines qualified
- Engineered stencil & paste-print per board