Automated SMT placement and through-hole assembly covering 01005 passives up to large BGA and QFN packages.
Our assembly floor runs automated SMT placement lines alongside selective and wave soldering for through-hole components, so mixed-technology boards run through a single production flow instead of being split across vendors. Placement accuracy holds tight enough for 01005 passives at one end of the range and large BGA, QFN, and CSP packages at 0.3 mm pitch at the other.
Both lead-free and leaded process lines are qualified, and stencil design and paste-print parameters are engineered per board rather than reused from a generic template — a meaningful source of first-pass yield problems we see when programs move from another vendor.
Configure your build on the RFQ calculator or send us your board files directly.
Bare-board fabrication from 2 to 12 copper layers on FR4, high-Tg, and RF laminates, built to the stack-up you configure.
Full mechanical and electrical integration — enclosures, cable/harness assembly, and final unit configuration.
Design-for-manufacturability review, file checking, and BOM/component sourcing before your first panel runs.